1999LOC Tape
Developed LOC tape for semiconductor DRAM TSOP PKG
Main Accomplishments
20013Layer FCCL
Developed in Korea, three-layered FCCL for flexible circuit boards
2001Coverlay
Developed in Korea, coverlay for flexible circuit boards
2002Lead Lock Tape
Developed lead lock tape for semiconductor ASIC TQFP PKG
2002Acrylic weak adhesive film
Developed acrylic weak adhesive film for flexible circuit boards
2002Double-sided heat sinking plane adhesive tape
Developed double-sided adhesive film for the adhering layer of semiconductor heat sinking planes
2003Highly Heat-resistant Film for Silicon
Developed a weak adhesive film of high heat resistance for silicon semiconductors
2003Polarizing Plate protection film
Developed polarizing plate protection film for LCDs
2003Encapsulating Adhesive
Developed encapsulating adhesive for cell phone saw filter PKGs
2004Bonding Sheet
Developed film to adhere layers for the manufacturing of multilayer FCCLs
2004Stiffener
Developed stiffener for flexible circuit boards
2006Low Tacky-type Acryl Adhesive Sheet
Developed low tacky-type acryl adhesive sheet at room temperature
2007Spacer Tape
Developed spacer tape for semiconductor PKG chip laminating layer
2008UV Dicing Tape
Developed dicing tape for wafer saw for semiconductor processing
2009Mold Release Film
Developed mold release film for semiconductor processing
2009QFN(Quad Flat No-Lead) Tape
Developed highly heat-resistant adhesive tape to prevent EMC molding leakage during QFN package semiconductor processing
2010DAF(Die Attach Film)
Developed die attach film for the laminating layer of semiconductor PKG chips
2010Backgrinding Tape
Developed backgrinding tape for CMOS image sensors
2011Metal CCL
Developed highly heat radiant metal CCL for LEDs
2011Black CVL
Developed acrylic black coverlay for flexible circuit boards
2012EMI Absorber Film for Digitizers
Developed EMI absorber film for digitizers
2012EMI Shielding Film
Developed an EMI shielding film that shields signal intervention during high-speed data transmission between mobile devices
20122 Layer FCCL
Developed a double-layered thin film FCCL for smartphone flexible circuit boards
2013Conductive Bonding Film (CBF)
Developed conductive bonding film (CBF) that shields signal intervention of mobile devices through the adhesion of metal reinforced boards
2013Hybrid QFN Tape
Developed hybrid QFN tape of highly heat-resistant adhering layers of phenoxy and epoxy base for high end QFN PKGs
2014Absorber Film for Digitizer
Development of technology for minimizing noise interference of RF antenna through magnetic induction and coupling phenomenon of soft magnetic sheet
2015Thermal Spread Sheet
Development of technology for thin, high design of freedom, and high thermal conductivity.
2016Bonding Sheet for Automotive PCB
PCB material for Automotive with excellent high heat resistance and Anti-migration characteristics
2016PI protection film
PI Protection film with heat resistance and reside-free properties for plating process
2018High Modulus DAF
Prevent wire bonging pad crack for thin wafer
